APA (7th ed.) Citation

Hwang, L., & Horng, T. J. (2018). 3D IC and RF SiPs: Advanced stacking and planar solutions for 5G mobility. John Wiley & Sons.

Chicago Style (17th ed.) Citation

Hwang, Lih-Tyng, and Tzyy-sheng Jason Horng. 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility. Hoboken, NJ: John Wiley & Sons, 2018.

MLA (9th ed.) Citation

Hwang, Lih-Tyng, and Tzyy-sheng Jason Horng. 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility. John Wiley & Sons, 2018.

Warning: These citations may not always be 100% accurate.