3D IC and RF SiPs advanced stacking and planar solutions for 5G mobility
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| Main Authors: | , |
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| Format: | Book |
| Language: | English |
| Published: |
Hoboken, NJ
John Wiley & Sons
2018
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| Subjects: | |
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| Physical Description: | xxxv, 425 pages illustrations 26 cm |
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| Bibliography: | Includes bibliographical references and index |
| ISBN: | 9781119289647 |