3D IC and RF SiPs advanced stacking and planar solutions for 5G mobility
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| Main Authors: | , |
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| Format: | Book |
| Language: | English |
| Published: |
Hoboken, NJ
John Wiley & Sons
2018
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| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | 52005 | ||
| 003 | MY-KLNDU | ||
| 005 | 20241219014102.0 | ||
| 008 | 221104 2018 njua b 001 0 eng d | ||
| 020 | |a 9781119289647 | ||
| 039 | 9 | |a 202211041221 |b VLOAD |c 202001201551 |d faezah |c 202001201547 |d faezah |y 201904031459 |z helmey | |
| 040 | |a UPNM |b eng |c UPNM |e rda | ||
| 090 | |a TK 5103.2 |b .H83 2018 | ||
| 100 | 1 | |a Hwang, Lih-Tyng |e author | |
| 245 | 1 | 0 | |a 3D IC and RF SiPs |b advanced stacking and planar solutions for 5G mobility |c by Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng |
| 246 | 3 | |a Three-dimensional integrated circuit | |
| 264 | 1 | |a Hoboken, NJ |b John Wiley & Sons |c 2018 | |
| 264 | 4 | |c © 2018 | |
| 300 | |a xxxv, 425 pages |b illustrations |c 26 cm | ||
| 336 | |a text |2 rdacontent | ||
| 337 | |a unmediated |2 rdamedia | ||
| 338 | |a volume |2 rdacarrier | ||
| 504 | |a Includes bibliographical references and index | ||
| 592 | |a 00101/HL/2019 (750) |b 30/9/2019 |c RM 612.75 |h Han Lin Books | ||
| 650 | 0 | |a Mobile communication systems |x Technological innovations | |
| 700 | 1 | |a Horng, Tzyy-sheng Jason |e author | |
| 999 | |a vtls000063248 |c 52005 |d 52005 | ||