3d integration in VLSI circuits implementation technologies and applications

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. To provide readers with state-o...

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Bibliographic Details

Other Authors:	Sakuma, Katsuyuki (Editor)
Format:	Book
Language:	English
Published:	Boca Raton, FL CRC Press, Taylor & Francis Group 2016
Series:	Devices, circuits, & systems
Subjects:	Three-dimensional integrated circuits. Integrated circuits > Very large scale integration.
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