Reliability and failure of electronic materials and devices

"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus...

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Bibliographic Details
Main Author: Ohring, Milton 1936
Other Authors: Kasprzak, Lucian
Format: Book
Language:English
Published: Boston Elsevier/Academic Press 2015
Edition:Second edition
Subjects:
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020 |a 9780120885749 (hbk) 
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040 |a MY-KlNDU  |b eng  |c MY-KlNDU  |e rda 
050 |a TK 7870.23  |b .O37 2015 
090 |a TK 7870.23  |b .O37 2015 
100 1 |a Ohring, Milton  |d 1936 
245 1 0 |a Reliability and failure of electronic materials and devices  |c Milton Ohring with Lucian Kasprzak 
250 |a Second edition 
264 1 |a Boston  |b Elsevier/Academic Press  |c 2015 
264 4 |a © 2015 
300 |a xxiv, 734 pages  |b illustrations  |c 24 cm 
336 |a text  |2 rdacontent 
337 |a unmediated  |2 rdamedia 
338 |a volume  |2 rdacarrier 
504 |a Includes bibliographical references and index 
505 8 |a An Overview of electronic devices and their reliability -- Electronic devices: how they operate and are fabricated -- defects, contaminants, and yield -- Mathematics of failure and reliability -- Mass transport-Induced failure -- Electronic charge-induced damage -- Environmental damage to electronic products -- Packaging materials, processes, and stresses -- Degradation of contacts and package interconnections -- Degradation and failure of electro-optical materials and devices -- Characterization and failure analysis of materials and devices --Future directions and reliability issues 
520 |a "Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"  |c Provided by publisher 
592 |a 41130  |b 23/12/2021  |c RM 630.54  |h Bookline Services 
650 0 |a Electronic apparatus and appliances  |x reliability 
650 0 |a System failures (engineering) 
700 1 |a Kasprzak, Lucian 
999 |a vtls000100424  |c 91059  |d 91059